P301- Micro Cut & Finish

Micro polishing compound with carnauba wax

Micro polishing compound for the permanent removal of holograms, fine scratches and sanding marks to P3000 grain size with simultaneous long-term Sealing with high degree of gloss and smoothness. Contains carnauba wax and non-fugitive silicones.

Recommendations for use Wet new or dry Micro Cut Pads completely with polish. Spread the polish evenly with the machine switched off. Switch the machine on (ideally an orbital polisher with forced rotation) and apply the polish crosswise with medium pressure thoroughly. Remove polish residue with a Profi microfibre cloth. Shake before using.